Imaging sensors detecting visible lights, X-rays and charged particles require innovations such as in sensitivity enhancement by hybridization of different materials, large-scale integration of fine size pixels, high-speed image transfer, and dynamic-range improvement for next stage applications in scientific, medical and industrial areas. One of the promising solutions is a 3D integration technology stacking different materials/chips vertically. This workshop is organized under a TIA-Kakehashi program "3D semiconductor quantum imaging sensor" (KEK-AIST-U Tokyo-U Tsukuba) to discuss directions of research activities with presentations on latest 3D integration technology and quantum imaging sensor technology.